APU and SkyeChip Forge Strategic Partnership to Advance IC Design Research

Asia Pacific University of Technology and Innovation (APU) has marked a significant milestone in advancing integrated circuit (IC) design research through a new collaboration with SkyeChip Sdn Bhd.

The partnership, formalised through a MoU signing ceremony held on October 3, 2024, on APU's campus situated in Technology Park Malaysia, Bukit Jalil, demonstrates both institutions' commitment to fostering innovation in semiconductor technology.

Mr Teoh Giap Seng (left), Co-Founder of SkyeChip exchanged signed documents with Associate Professor Ir Ts Dr Siva Kumar Sivanesan, Head of SoE during the signing ceremony.

The collaboration includes two pioneering research projects: "NoC Topology Optimization/Generation via Reinforcement Learning" and "Hardware Encryption Engine". SkyeChip has demonstrated its commitment to this initiative with a substantial research grant of RM27,000, underlining the industry's support for academic advancement in IC design.

Mr Teoh Giap Seng, Co-Founder of SkyeChip, expressed his enthusiasm about the partnership, particularly noting the importance of nurturing IC design expertise at the university level. After reviewing APU's course curriculum, Mr Teoh affirmed that the university's academic approach aligns well with industry requirements, stating that "the course map is on the right track."

A group photo of SkyeChip leadership and staff members, along with SoE faculty members from APU.

Associate Professor Ir Ts Dr Siva Kumar Sivanesan, Head of School of Engineering at APU, highlighted the strategic value of this partnership. He emphasised how this collaboration creates a comprehensive development pathway for students, beginning with their academic studies and extending through internship opportunities to meaningful final-year projects.

Dr Siva also extended his congratulations to SkyeChip on the opening of their new Klang Valley office at Puchong Financial Convention Center (PFCC), marking another milestone in the company's growth.

The partnership was successfully coordinated through the efforts of a dedicated team of faculty members at the School of Engineering (SoE), including Assistant Professor Ir Eur Ing Ts Dr Lau Chee Yong, Lecturer Ir Dr Soon Kian Lun, and Associate Professor Dr Lai Nai Shyan.

This collaboration represents a significant step forward in bridging the gap between academic research and industry applications in IC design. It not only provides students with valuable industry exposure but also strengthens the university's research capabilities in semiconductor technology. The partnership is expected to yield innovative solutions in IC design while preparing the next generation of engineers for the challenges of the semiconductor industry.

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A conversation between SkyeChip and APU took place prior to the MoU signing ceremony.

For both APU and SkyeChip, this partnership marks the beginning of what promises to be a fruitful collaboration that will contribute significantly to the advancement of IC design research and education in Malaysia. The initiative aligns perfectly with the growing demand for semiconductor expertise in the region and positions APU at the forefront of IC design education and research.